Kessel™ Pishow® M2

8" Metal Etching System

Inductively Coupled Plasma Etching (ICP) | Strip

System Features

  • The Kessel™ Pishow® M2 system is intended for volume production of 8" IC wafers
  • Consists of ICP etch chambers, strip chambers, a cooling chamber, and a transfer module
  • Ideal for aluminum interconnect etch all the way down to the 0.11 μm generation
  • Also provides 6" options

Process Data

Stable Pattern Profile Within 400 RF·h


The Kessel™ Pishow® M2 metal etching system is a cluster tool for 8" IC mass production using the aluminum interconnect process. The optimized design of this proprietary system offers excellent etch uniformity (< 5% within wafer, and < 3% wafer to wafer), high etch selectivity (Al : PR > 2.4), and great particle control.

For aluminum interconnect line etch of the 0.11 μm technology node, Kessel™ Pishow® M2 has a throughput of up to 20,000 wafers per month. With mean-time-between-clean of up to 400 RF·h, Pishow® M2 offers excellent stability. This cost-effective system has a small footprint, which greatly enhances production capacity.