Terbank™ Pishow® D
Heverlee® Pishow® D
Haasrode® Pishow® D
High Aspect Ratio, Excellent Depth Control, Steep Profile, Smooth Sidewall
Deep reactive ion etch is a common practice during micro-/nano- device fabrication. The
This system offers cost-effective solutions and has a small footprint, greatly enhances process throughput and production capacity.