12" Metal Hardmask Opening System
Inductively Coupled Plasma Etch (ICP)
System Features
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The Herent® Chimera® S metal hardmask opening system is intended for volume production of 12" IC wafers
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Consists of ICP etch chambers and a transfer module
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Suitable for 55 nm ~ 14 nm generation TiN metal hardmask opening and self-aligned double patterning (SADP) processes