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Herent® Chimera® M

12" Metal Etching System

Inductively Coupled Plasma Etching (ICP) | Strip



System Features

  • The Herent® Chimera® M metal etching system is intended for volume production of 12" IC wafers
  • Consists of ICP etch chambers, strip chambers, and a transfer module
  • For high density aluminum interconnect logic applications and aluminum pad processes starting from 0.18 μm nodes 

Overview

The Herent® Chimera® M system is suitable for 12" IC fabs. While designed specifically for back-end-of-line (BEOL) high density aluminum interconnect processes starting from 0.18 μm technology nodes, Herent® Chimera® M also has applications in BEOL aluminum pad processes. This system offers superior uniformity control and cost-effective solutions.

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