Terbank™ Pishow® P

8" Silicon Etching System

Inductively Coupled Plasma Etching (ICP)



System Features

  • The Terbank™ Pishow® P silicon etching system is intended for volume production of 8" IC wafers
  • Consists of ICP etch chambers and a transfer module
  • Suitable for polysilicon gate etch, spacer etch, and shallow trench isolation (STI) applications all the way down to the 0.11 μm generation

Process Data

0.25 μm Trench

Overview

The Terbank™ Pishow® P system is a gate etch cluster equipment for 8" IC fabs. Its proprietary design delivers great uniformity (< 5% both within wafer and wafer to wafer) and particle control. Besides gate etch applications, this system is also suitable for STI, AA, W recess, and spacer etch processes.

This system offers cost-effective solutions and has a small footprint, greatly enhances process throughput and production capacity.

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