The Terbank™ Pishow® P silicon etching system is intended for volume production of 8" IC wafers
Consists of ICP etch chambers and a transfer module
Suitable for polysilicon gate etch, spacer etch, and shallow trench isolation (STI) applications all the way down to the 0.11 μm generation
3 μm Trench
0.4 μm Trench
0.25 μm Trench
2 μm Poly
0.18 μm Poly
The Terbank™ Pishow® P system is a gate etch cluster equipment for 8" IC fabs. Its proprietary design delivers great uniformity (< 5% both within wafer and wafer to wafer) and particle control. Besides gate etch applications, this system is also suitable for STI, AA, W recess, and spacer etch processes.
This system offers cost-effective solutions and has a small footprint, greatly enhances process throughput and production capacity.