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Seehund^®

Vapor Phase Decomposition System

Vapor Phase Decomposition (VPD)

System Features

Compatible with 12" and 8" wafers
Applicable for metallic contamination monitoring in IC fabrication, wafer manufacturing and wafer reclaim processes
Used in combination with an inductively coupled plasma mass spectrometer (ICP-MS), or a total reflection X-ray fluorescence spectrometer (TXRF)
With the help of the VPD, the contaminant detection limits for ICP-MS or TXRF are improved by two orders of magnitude. This drastically enhances the detection sensitivity, meeting the needs to monitor and control trace amounts of metal contamination in the above-mentioned industries

System Performance

Recovery Efficiency of VPD

Element	Atomic Number	Molar Mass (g/mol)	Recovery Efficiency (%)
K	19	39.10	≥ 95
Ca	20	40.08	≥ 90
Cr	24	52.01	≥ 95
Mn	25	54.94	≥ 95
Fe	26	55.85	≥ 95
Ni	28	58.71	≥ 95
Cu	29	63.55	≥ 82
Zn	30	65.39	≥ 95

Testing Data for VPD Paired with TXRF

Element	Detection Limit (E10 atoms/cm²)	VPD Sample Concentration (E10 atoms/cm²)
Element	Detection Limit (E10 atoms/cm²)	1 Iteration, Center	1 Iteration, Edge	2 Iterations, Center	2 Iterations, Edge
K	14.46	87.89	0.09	184.42	0.09
Ca	10.48	125.38	0.10	203.55	0.18
Cr	2.99	18.27	0.10	43.79	0.02
Mn	2.23	11.7	0.00	1972	0.00
Fe	1.84	160.00	0.09	213.6	0.18
Ni	1.30	34.09	0.00	71.52	0.00
Cu	1.08	10.19	0.64	43.95	0.89
Zn	0.95	64.51	0.00	160.28	0.00

Process Data

TXRF Detection Limit Improves Hundredfold with VPD

Element Recovery Rate: VPD & ICP-MS

Overview

The Seehund^® VPD system is a proprietary product developed specifically to monitor surface metallic impurities for IC fabrication, wafer manufacturing, and wafer reclaim. This system uses standard parts widely adopted by 300 mm production lines around the globe. Its design is compliant with SEMI Standards.