Vapor Phase Decomposition System
Vapor Phase Decomposition (VPD)
System Features
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Compatible with 12" and 8" wafers
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6" compatible with carrier wafers
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Applicable for metallic contamination monitoring in IC fabrication, wafer manufacturing and wafer reclaim processes
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Used in combination with an inductively coupled plasma mass spectrometer (ICP-MS), or a total reflection X-ray fluorescence spectrometer (TXRF)
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VPD improves the contaminant detection limits for ICP-MS or TXRF by two orders of magnitude. This drastically enhances the detection sensitivity, meeting the needs to monitor and control trace amounts of metal contamination in the above-mentioned industries