Haasrode® Avior® A

6" Capacitively Coupled Plasma Etching System

Capacitively Coupled Plasma (CCP)

System Features

  • Single Chamber CCP etching system
  • Suitable for photoresist descum applications and dielectric etch processes
  • Maximum wafer size: 6 inch

Process Data


CCP is a common plasma etching technology for manufacturing micro-/nano-structures. During the reactive ion etch, large quantities of reactive species from the plasma will react with surface atoms, forming volatile products. The exhaust was then pumped out by a vacuum system. Haasrode® Avior® A is a small footprint system, making it especially cost-effective. The system also provides solutions for etching a variety of materials.