12" Special Metal Stack Etching Cluster
Reactive Ion Etch (RIE) | Ion Beam Etch (IBE) | Plasma Enhanced Chemical Vapor Deposition (PECVD)
System Features
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The Chimera® N RIE chamber, Pangea® A IBE chamber, and Basalt® A PECVD chamber are all integrated into a cluster system
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The LMEC-300™ system enables plasma etching, dry cleaning and in-situ passivation for materials with non-volatile etching byproducts, including magnetic tunnel junctions (MTJs), phase change
alloys, metal-oxide-metal resistive stacks
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Offers different solutions and processes for patterning magnetic random access memories (MRAMs), phase change random access memories (PCRAMs), resistive random access memories (ReRAMs), and magnetic sensors
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Optional Chimera® A hardmask opening (HMOP) chamber, for all-in-one solution from HMOP to functioning layer etching
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Suitable for 12" wafers